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GX103
1 Basic Performance
Multiple Device Access (MDA)
——Global read and write operations
• Temperature measurement range: -40 ° C~+125 ° C
Temperature measurement accuracy: ± 1 ° C (-40 ° C~+125 ° C)
• Packaging: 4-Ball WCSP (DSBGA)
• Power supply voltage
GX103x:1.4V ~ 2.8V
GX103S :1.4V ~ 3.6V
• Low static current
Normal operation: ≤ 3 μ A (0.25Hz)
Off mode: ≤ 1 μ A
• Resolution
GX103x: 8Bits
GX103S :11Bits
• Digital output: compatible with SMBus and I2C interfaces
2 Application Scenarios
• Mobile phone
• Laptop computer
Solid state drives (SSDs)
• Server
• Set top box
Low power consumption environment
• Sensors
3. Chip Overview
The GX103 series temperature sensors all use 4-Ball wafer level packaging, with a temperature measurement resolution of 1 ℃ for GX103x and 0.125 ℃ for GX103S.
The two-wire interface of GX103 series is compatible with SMBus and I2C communication mode and support for Multi Chip Access (MDA) commands, enabling the host to communicate with multiple chips on the bus simultaneously without the need to send separate read and write commands to each GX103 series chip. The GX103x supports mounting up to 8 different address chips on a main line, while the GX103S supports mounting 16 different address chips.
The GX103 series is suitable for systems with limited temperature measurement areas, temperature sensitivity, and the need to measure and monitor multiple temperature areas. The GX103 series has a rated operating temperature range of -40 ℃ to+125 ℃.


Product Parameters
| Communication method | I2C/SMBus | Working temperature range | -40℃~+125℃ |
|---|---|---|---|
| Highest accuracy | ±0.25℃ | Resolution | 8bit |
| Working Voltage | 1.4V~2.8V | Convert time | 26ms |
| Number of addresses | 8 | Standby Power Consumption | 0.1μA |
| Package form | WLCSP-4 |
